Hardware Enclosure, Tamper Detection Mesh & Zeroization Verification

Core engineering and protocols for FIPS 140-3 Physical Boundary & Tamper.

Physical Enclosure Engineering for Post-Quantum HSMs

FIPS 140-3 Level 3 mandates hard, opaque enclosures with active tamper-detection mechanisms that continuously supervise the physical enclosure. In post-quantum modules handling large ML-KEM secret keys (e.g., 2,400 bytes for ML-KEM-768), zeroization controllers must be capable of flash-scrubbing SRAM cells within nanoseconds of mesh penetration or voltage glitch triggers.

Environmental Failure Testing & In-Flight Destruction

Validation testing includes temperature excursion profiling (-40°C to +105°C), optical strobe inspection (laser fault injection), and power ripple injection. MLKEMCert provides automated test fixtures that simulate physical breach vectors while recording the module's defensive state transitions and verified zeroization state.

Explore Technical Architecture & Portfolio